The prestigious IEEE 30th International Symposium on Physical & Failure Analysis of Integrated Circuits (IPFA 2023) was held for the first time in Penang, Malaysia from 24th to 27th July 2023 at Bayview Beach Resort Hotel through the collaboration between IEEE, IPFA organizing committee, semiconductor companies, equipment suppliers, lab service providers and USM (University Science of Malaysia).
ASE Malaysia is proud to have participated in the IEEE 30th International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA 2023) by being part of the organising committee, sponsoring a booth and technical paper submissions. Two technical papers from ASE Malaysia were qualified for oral and poster presentations in the symposium.
YBhg. Dato' Dr. Haji Megat Sany bin Megat Ahmad Supian (Deputy Secretary General (Policy) Ministry of Higher Education) officiating ASEM booth at IPFA
ASE Malaysia Exhibition Booth
- State-Of-The-Art Approach To Mitigate Risk of Die Crack With Substrate Co-Planarity Issue (Cham Hooi Ying, Ooi Jen Wai, Tan Thian Yik, Tan Yin Heng & Ng Kok Aun)
- Novel Approach To Resolve Strip Camber At Assembly Process of Semiconductor Packaging (Ooi Jen Wai, Cham Hooi Ying, Tan Yin Heng, Tan Thian Yik & Theow Chiew How)
ASE Malaysia also won 2nd prize in the Art of FA Contest with its mesmerizing original FA SEM image of “Blossoms in Flight: Sakura Symphony”
“The season of cold and challenging winter is coming to an end, giving way to a sense of renewal, hope and joy that accompanies the arrival of the spring season.”
Overall, the IPFA Technical Symposium benefited cross-functional groups including QA, Failure Analysis Team, Design Engineers & Manufacturing Teams in ASE Malaysia through multiple paper presentations and discourses by international speakers and academia fraternity.
ASE Malaysia has always worked towards cultivating a strong technical research and world class engineering culture. This engages their engineers to look for breakthrough solutions and innovations that will heighten the quality and reliability of semiconductor packages produced by ASE Malaysia.
The upcoming IPFA 2024 will be held in Singapore and ASE Malaysia has started to explore and work on technical paper submissions for the upcoming symposium, demonstrating our commitment to continuous participation in international forums.
Semiconductor devices are used in every aspect of our lives, such as improving connectivity, computing, consumer, medical, industrial and automotive products. The strategy for ASE Malaysia in navigating through the advancements in semiconductor technology is by staying on top with the latest trends, tools and techniques. With this, ASE Malaysia applies the best-known method in designing and manufacturing reliable products to meet the quality requirements of the end applications.