Company Profile

Our Company Information

A Success Enabler

ASE Electronics (M) Sdn. Bhd. was established in 1991 and located in Penang, Malaysia.

We are a semiconductor manufacturing service provider of assembly packaging and testing solutions to global semiconductor companies.

Vision & Mission

To offer the best design manufacturing services for IC packaging, IC substrates, IC testing and systems. ASE will act as an extension of our customers’ own operations in achieving the maximum business objectives with minimum resources and smart manufacturing.
To stay ahead of the semiconductor technology curve, ASE maintains a highly experienced and skilled engineering team that continuously research and develop the very latest in assembly technology.
ASE leverages on AI, Big Data and Smart Automation to enable smart manufacturing.

Global Leadership

ASE Malaysia is part of Advanced Semiconductor Engineering (ASE) Group, the world’s largest provider of independent semiconductor manufacturing services in assembly and test. As a global leader, ASE provides a complete scope of services for the semiconductor market; driven by superior technologies, breakthrough innovations, and advanced development program.

Innovation

Our innovation products consist of a wide range of advanced and legacy semiconductor packaging and testing services.

ASE Malaysia assembly deploys either leadframes or substrates as packaging interconnect materials. Gold /Copper wire is adopted in wirebonding.

ASE Malaysia is one of the pioneers in adopting copper wire bonding technology.

We offer copper wire to support our valued customer in lowering the packaging cost.

We also provide backend 12"/8' wafer level chip scale package (WLCSP).

Certified

ASE Malaysia is certified to ISO9001, ISO/TS16949, ISO14001 and IECQQC080000 standards.

Our Services

Turnkey manufacturing services.

We offer full turnkey manufacturing services solutions to our valued customers.

Our turnkey services include semiconductor packaging; design and manufacturing of interconnect materials, front-end engineering testing, wafer probing, final testing services and direct shipment of semiconductor units to end users designated by our valued customers.

Besides that we also extend our testing services to untested packaged units shipped from other sites.

Module assembly services.

Likewise, ASE Malaysia offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable increased functionality, typically using automated surface mount technology, or SMT machines.

Imaging sensor packaging was added in Year 2013 as our latest product extension to serve our valued customers.

Testing Services.

ASE Malaysia's testing services include front-end engineering testing, which is performed during and following the initial circuit design stage of the semiconductor manufacturing process, wafer probe, final testing and other related semiconductor testing services. It focuses on packaging/wafer level testing logic semiconductors.

ASE Malaysia packaged products are used in a wide range of end applications, including communications, computers, consumer electronics, industrial, automotive and other applications.