FOL Equipment Engineer
Requirements
- Degree in Electronics / Electrical /Chemical/Mechanical Engineering.
Minimum 3 years related working experience.
- Must be able converse in English, Mandarin is added advantage.
Job Responsibilities
- Fully accountable to maintain required equipment OEE and equipment downtime performance.
- Responsible to ensure process compliance in operation and improve product unit per hour (UPH).
- Maintain product tracking and ensure proper maintenance and troubleshooting procedures for reference purposes.
- To provide technical assistance in installation and maintenance of equipment.
Develop and sustain preventive maintenance procedures to reduce equipment failures.
- Develop cost reduction strategies/initiatives while still maintaining quality and productivity.
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EOL Equipment Engineer
Requirements
- Degree in Electronics / Electrical /Chemical/Mechanical Engineering.
Minimum 3 years related working experience.
- Must be able converse in English, Mandarin is added advantage.
Job Responsibilities
- Fully accountable to maintain required equipment OEE and equipment downtime performance.
- Responsible to ensure process compliance in operation and improve product unit per hour (UPH).
- Maintain product tracking and ensure proper maintenance and troubleshooting procedures for reference purposes.
To provide technical assistance in installation and maintenance of equipment.
- Develop and sustain preventive maintenance procedures to reduce equipment failures.
- Develop cost reduction strategies/initiatives while still maintaining quality and productivity.
Perform equipment upgrade based on requirements provided.
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QA Senior Engineer
Requirements
- Degree in Engineering.
- Good in manufacturing process knowledge.
- Project management skills will be added advantage.
- Positive attitude and ability to communicate well with all levels.
Job Responsibilities
- Monitor and analyse quality performance and drive for improvement.
- Develop and implement any required quality control procedures, specifications, forms, checklists, reports, etc.
- Performs internal audits of the process to ensure compliance.
- Review SPC indicators and coordinate out of control action plan.
- Coordinate 8D review, action implementation, validation and verification.
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IT Engineer
Requirements
- Degree in Computer Science, Information Technology or related qualification
- At least 3 years application development experience using programming tools such as ABAP/4, Visual Basic, ASP, Java, MS Transact SQL and Oracle PL/SQL
- Application support experience with top-notch ERP (e.g. SAP, Oracle) system will be an added advantage
- Good functional knowledge of ERP business processes
- Strong technical background with good analytical and problem solving skills
Job Responsibilities
- Design, develop, test, deploy and maintain applications for ERP systems
- Undertake application development and enhancement tasks to fulfill users’ requirements
- Work closely with functional teams to provide seamless integration to other enterprise and related systems, where applicable
- Support and troubleshoot issues arising from the systems and/or interfaces to other systems
- Provide relevant system and user documentation
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Die Attach Engineer
Requirements
- Degree in Electronics / Electrical /Mechanical Engineering.
- Min 2 years in semiconductor industry in the field of assembly engineering.
- Experience in die attach process.
- Good knowledge of FMEA, DOE, SPEC and risk analysis.
- Independent with good communication skills and ability to work effectively in a cross functional environment with people at all levels.
Job Responsibilities
- Responsible for process ownership of Die Attach machine in assembly line.
- Establish and setup new die attach assembly process capabilities and materials including hand-on equipment setup.
- Monitor performance, quality and reliability of die attach process. Identify problems, recommendation, and implementation of corrective and preventive actions.
- Support engineering build requests, rump ups and platform extensions.
- Monitor and improving the yield of die attach process, including cost reduction activities.
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