ASEM Failure Analysis (FA) and Reliability Lab is a one stop analysis center with the latest cutting-edge FA and Reliability equipment to analyze package related failures and also to stress the package according to the latest industry requirements to ensure the highest quality assembled products are shipped out to our end customers. Our well-equipped Lab supports a variety of FA and Reliability analysis from product package design, qualification until manufacturing stage including customer returns.
Our well-trained technical specialists with years of working experience are committed to work with highest degree of technical collaboration which will satisfy all your requirements. We are proud to be your one-stop lab service provider with the best affordability and fast turnaround of FA and Reliability Stress result. Our Lab support is 24x7 which is one of the best services in town!
This analytical technique used for image magnification and elemental analysis or chemical characterization.
OPERATING RANGE:
This analytical technique used for high resolution image magnification and elemental analysis or chemical characterization.
To characterize and locate faults in metallic cables with objective for fault isolation failure location.
Optical inspection at high magnification.
Optical inspection at low magnification.
To perform semiconductor IV analysis to validate failure prior to destructive FA analysis.
Fault isolation test between package and die.
To inspect damages/ defect on wires or solder balls.
OPERATING RANGE: Dispersive
To remove mold compound to inspect internal defect.
To thin down mold compound prior to chemical decap.
Cross section to the desired area for failure analysis.
To identify organic material.
Cross-section polishing prior to SEM analysis
To detect thermal or photo emission of a fault location within a package or die level.
DETECTION CAPABILITY: