Reliability Program

Introduction

ASEM Failure Analysis (FA) and Reliability Lab is a one stop analysis center with the latest cutting-edge FA and Reliability equipment to analyze package related failures and also to stress the package according to the latest industry requirements to ensure the highest quality assembled products are shipped out to our end customers. Our well-equipped Lab supports a variety of FA and Reliability analysis from product package design, qualification until manufacturing stage including customer returns.

Our well-trained technical specialists with years of working experience are committed to work with highest degree of technical collaboration which will satisfy all your requirements. We are proud to be your one-stop lab service provider with the best affordability and fast turnaround of FA and Reliability Stress result. Our Lab support is 24x7 which is one of the best services in town!

Bake Oven

To remove all moisture from the package so that it will be “dry" for subsequent process

Temp: 125°C
Max.Temp: 260°C
Ref: JESD22-A113 & J-STD-020

Bake Oven High Temperature Storage (HTS)

To simulate the thermal and mechanical stress imposed on device when mounted on PCB

150°C
Max.Temp: 260°C
Ref: JESD 22 - A103

Temperature Cycle (TC)

To evaluate package and die interface mechanical resistance to alternate exposure of high and low temperature changes, as well as its ability to withstand cyclical stresses

Temp range hot: +60 °C to +220 °C
Temp range cold: -10 °C to -80 °C
Ramp rate: 10°C to 15°C/minute
Ref: JESD 22- A104

Temperature Cycle (TC)

To evaluate package and die interface mechanical resistance to alternate exposure of high and low temperature changes, as well as its ability to withstand cyclical stresses

Temp range hot: +50 °C to +220 °C
Temp range cold: -80 °C to +70 °C
Ramp rate: 10°C to 15°C/minute
Ref: JESD 22- A104

Temperature Cycle (TC)

To evaluate package and die interface mechanical resistance to alternate exposure of high and low temperature changes, as well as its ability to withstand cyclical stresses

Temp range hot: +50 °C to +200 °C
Temp range cold: -80 °C to +100 °C
Ramp rate: 10°C to 15°C/minute
Ref: JESD 22- A104

Pressure Cooker Test or Autoclave (PCT)

To evaluate the stress test integrity of mold compound and leadframe interface to simulate extreme operating conditions (pressure, temperature and humidity for various lengths of timeframe)

Test Temp range: 105°C to 150°C
Test Humidity range: 65% to 100%RH
Test Pressure range: 14.5psi to 43.5psi
Ref: JESD22-A102

Highly Accelerated Stress Test (Unbiased/Biased)

To evaluate the stress test integrity of mold compound and leadframe interface to simulate extreme operating conditions (temperature and humidity for various lengths of timeframe with or without biased)

Test Temp range: 105°C to 150°C
Test Humidity range: 65% to 100%RH
Test Pressure range: 14.5psi to 43.5psi
Power Supply range : Voltage - 0 to 40V, Current - 0 to 25A (3 Power Supplies)
Ref: JESD22-A118 (UHAST)/JESD22-A110 (BHAST)

Temperature and Humidity Test

To evaluate the moisture resistance (preconditioning) of package as per MSL level or customer requirement.

As per JEDEC MSL requirement
Temp: 160°C to - 40°C
Humidity range: 10% to 98% RH
Ref: JESD22-A113 & J-STD-020

Reflow Simulation

To evaluate the thermal and mechanical stressed imposed on a device during SMT/Reflow process

Convection Type
5 Zones Reflow
Max Peak Ta = 350°C max
Ref: JEDEC A112/113 & J-STD-020

Scanning Acoustics Microscope (SAM) or Scanning Acoustic Tomography (SAT) Inspection

To perform non- destructive study on the package structure for any abnormality such as delamination, cracking etc using acoustic signal

Type of scan: A-scan, B-scan, C-scan, Thru Scan, Tami Scan
Transducers used: 15MHz, 25MHz, 35MHz, 75MHz ,110MHz & UHF 5.9mm
Delamination acceptance criteria as per JEDEC standard.
Ref: J-STD-020 & J-STD-035