ASE Malaysia manufactures high volume memory devices for both consumer and enterprise markets.

The Memory Business Unit incorporates a captive line producing only memory devices from uSD, SD to USB drives for the consumer market. These devices are SipLGA based packages with multiple passive components surface mounted and multi-stacked die capability.

High volume TSOP (Thin Small Outline Package) packages are also manufactured for the enterprise market segment.

ASEM’s manufacturing readiness includes ultra thin die capability (1.2mil), high yield performance, up to 4 die stack (8 DS and above under development) and high-parallelism testing.