ASE Malaysia is a subsidiary of ASE Inc.*, the world's leading provider of semiconductor manufacturing services in assembly and test. We are committed to helping our customers succeed in the dynamic semiconductor market by providing them with transformative technologies, breakthrough innovations, and advanced development programs.
*ASE Inc. is a member of ASE Technology Holding Co., Ltd.

Customer Center

Access to online service is reserved for registered customers only.


Leadframe Packaging

Wire Bond BGA

Flip Chip Packaging

Power DFN/QFN with Cu clip

Memory Packaging

WLCSP (backend)

Our Capabilities

Products & Services

ASE Malaysia develops and offers complete turnkey solutions for assembling and testing a wide range of packages, including a broad QFP, TQFP, BGA, SOIC, SOJ, and PDIP portfolio. We use highly automated processes and state-of-the-art equipment to ensure the highest quality and reliability of our services.

Our Capabilities

Quality Management

ASE Malaysia is committed to continuous quality improvement in semiconductor manufacturing services.