WLCSP (Wafer-level Chip Scale Packaging) refers to the technology of packaging an integrated circuit at the wafer level, instead of the traditional process of assembling individual units in packages after dicing them from a wafer. WLCSP package is just a bare die with a redistribution layer (RDL, interposer or I/O pitch) to rearrange the pins or contacts on the die so that they can be big enough and have sufficient spacing so that they can be handled just like a ball grid array (BGA) package.

The key advantages of the WLCSP is the die to PCB inductance is minimized, reduced package size, and enhanced thermal conduction characteristics, and no bond wires or interposer connections are required.