Wire Bond BGA

ASE Wire Bond BGA Packaging Offerings

Plastic ball grid array (PBGA) are BGA packages adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA has an overall thickness of over 1.7mm.

Application

ASE PBGA's design and features improve the performance of

  • Graphics
  • PLDs
  • DSPs
  • PC Chipsets
  • Communications
  • Networking
  • Microprocessors/Controllers
  • ASIC, Gate Arrays
  • Memory Packages

Features

BGA is suitable for high power and high speed ICs requiring superb electrical and thermal enhancement.

  • 17x17mm to 35x35mm package
  • 208 balls to 1156 ball count
  • High interconnect density
  • Low assembly cost
  • Self-alignment during reflow
  • Low profile
  • Ease of thermal and electrical management
  • Ease of routing
  • Good power dissipation
  • JEDEC MS-034 standard outlines
  • Lead free process available
  • Full In-house design capability

Heat Slug BGA (HSBGA) is an upgraded type of PBGA. Within the molding area, a piece of copper heat slug is implanted. The heat slug is intended to lower the thermal resistance (θJA) of PBGA without change of material. The θJA of HSBGA is generally 20% lower than PBGA and achieves 5 to 6W of thermal dissipation under natural convection. This technology can be applied to any kind of die-up substrates (e.g. 2- or 4-layer BT, and metal core). HSBGA is an excellent solution for cost-effective high power package, high-speed ICs like graphics chips, communication and networking ICs.

Application

HSBGA is excellent for products that require improved thermal performance such as high power packages for high speed ICs in personal computers, networking and graphic ICs, data communication, consumer ICs and in telecommunication applications.

Features

HSBGA is suitable for high power and high speed ICs requiring superb electrical and thermal enhancement.

  • 17x17mm to 35x35mm package available
  • 252 balls to 680 ball count available
  • Cost effective
  • Good electrical performance
  • Good thermal performance
  • Good power dissipation
  • JEDEC MS-034 standard outlines
  • Lead free process ready and available
  • Full In-house design capabilityli>
  • Thermal characterization capability

CSP (chip scale package or chip size package) is a package that has an area of not more than 120% of the die. It is suitable for compact 2nd-level packaging efficiency. With better protection by ruggedized encapsulation and better 2nd-level reliability (or board level reliability), CSP prevails over the direct chip attach (DCA) and chip on board (COB) technology. This package makes the IC sturdy enough for easier handling, and testability. Providing low-cost test and burn-in, CSP is a substitute for known good die (KGD) with comparable electrical performance. In addition to required signal and power transmission contacts, some CSPs provide a direct thermal path for heat removal from the chip.

CSP Offerings


Leadless – LGA

LGA (Land Grid Array), an offshoot of BGA without solder balls, is another leadless package. LGA has the advantage of flexible routing to implement both electrical and thermal enhancement (for more product data, please refer to Leadless Package).

FBGAs

Low & Thin BGAs (L(F)BGA, T(F) BGA, V(F)BGA, W(F)BGA, U(F)BGA) are the fi ne ball pitch (as small as 0.4mm) and thin profile ( thinner than 1mm) types of BGA as defined by JEDEC. These packages are capable of customized design, and therefore can be fabricated to near chip size

CSP Leadless – LGA

Product Overview

Land grid array (LGA) uses laminate substrate to form the landing pad and the exposed pad for performance enhancement. It is essentially a BGA minus the solder balls. LGA’s advantage over other leadless packages are its flexible routing and multi-chip module capability. LGA is also a thinner (down to 0.5 mm) and lighter CSP. LGA technology has been developed for lead free solution and spacing reduction on mother boards. This type of package has chip size solution based on mature laminated substrate technology and material.

Application

LGA is suitable for high performance ICs like Single Chip, CPU, Logic and Memory. Common applications for this type of package includes:

Telecommunication products

Cellular phone – RF Devices, Wireless LAN

Portable products

Personal digital assistants, Digital camera, IC recorder, MP3 players

Memory card

SD card, MS card, PCMCIA, Compact

Features

  • 4x4 to 25x11.1mm packages are available
  • 4 land lead to 84 land lead count available
  • Thinner, lighter and smaller Chip-Scale Package
  • Lower cost
  • Space reduction in system level
  • Pb free solution
  • Excellent electrical and thermal performance
  • Full In-house design capability

CSP FBGA - LF/TF/VF/WF BGA

Product Overview

The thin package solution due to significant improvement in substrate and die thinning technology.

Package Total Thickness Package Profile Solder Ball Pitch
LFBGA 1.20~1.70mm Low Profile Fine Solder Ball Pitch
TFBGA 1.00~1.20mm Thin Profile Fine Solder Ball Pitch
VFBGA 0.80~1.00mm Very Thin Profile Fine Solder Ball Pitch
WFBGA 0.65~0.80mm Very Very Thin Profile Fine Fine Solder Ball Pitch
  • Small, thin and light package
  • Flexible design
  • Low cost and & time to market high volume production
  • Competitive reliability performance (MSL3@260°C)

Application

  • Computer, Communication, and Consumer Devices
  • Memory (SRAM, PSRAM, Flash, DRAM), Graphic, ASIC, Digital and Analog Products

Features

  • 2.5x2.5 to 27x27mm packages are available
  • 36 balls to 756 ball count available
  • Rigid and customized routing substrate design
  • High density interconnection and High speed performance
  • Low assembly cost
  • Lower profile (Package thickness)
  • RoHS/ Pb Free & Green Package process ready and available
  • Ease of thermal and electrical management
  • JEDEC standard criteria
  • Full in-house design capability