Malaysia
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Company Profile
Consolidator Enabler
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Products
Leadframe Packaging
Wire Bond BGA
Flip Chip Packaging
Power DFN/QFN with Cu clip
Memory Packaging
WLCSP (backend)
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Final Test
Wafer Sort
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Mixed Signal
Digital
System-on-Chip
RF/RF Mixed
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Image Sensor
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Test Solutions
System-on-Chip
System-on-Chip
Current Tester
Advantest V93K PS1600
LTXc ASL 1K
Teradyne ETS364
Accotest STS8200
Under Research
Accotest STS8300
Applications
High power devices
Video/Audio Processor
Boost/Buck converters
DC/DC, DC/AC, AC/DC converters
Roadmaps