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FOL Equipment Engineer

Requirements

  • Degree in Electronics / Electrical /Chemical/Mechanical Engineering. Minimum 3 years related working experience.
  • Must be able converse in English, Mandarin is added advantage.

Job Responsibilities

  • Fully accountable to maintain required equipment OEE and equipment downtime performance.
  • Responsible to ensure process compliance in operation and improve product unit per hour (UPH).
  • Maintain product tracking and ensure proper maintenance and troubleshooting procedures for reference purposes.
  • To provide technical assistance in installation and maintenance of equipment. Develop and sustain preventive maintenance procedures to reduce equipment failures.
  • Develop cost reduction strategies/initiatives while still maintaining quality and productivity.

EOL Equipment Engineer

Requirements

  • Degree in Electronics / Electrical /Chemical/Mechanical Engineering. Minimum 3 years related working experience.
  • Must be able converse in English, Mandarin is added advantage.

Job Responsibilities

  • Fully accountable to maintain required equipment OEE and equipment downtime performance.
  • Responsible to ensure process compliance in operation and improve product unit per hour (UPH).
  • Maintain product tracking and ensure proper maintenance and troubleshooting procedures for reference purposes. To provide technical assistance in installation and maintenance of equipment.
  • Develop and sustain preventive maintenance procedures to reduce equipment failures.
  • Develop cost reduction strategies/initiatives while still maintaining quality and productivity. Perform equipment upgrade based on requirements provided.

QA Senior Engineer

Requirements

  • Degree in Engineering.
  • Good in manufacturing process knowledge.
  • Project management skills will be added advantage.
  • Positive attitude and ability to communicate well with all levels.

Job Responsibilities

  • Monitor and analyse quality performance and drive for improvement.
  • Develop and implement any required quality control procedures, specifications, forms, checklists, reports, etc.
  • Performs internal audits of the process to ensure compliance.
  • Review SPC indicators and coordinate out of control action plan.
  • Coordinate 8D review, action implementation, validation and verification.

IT Engineer

Requirements

  • Degree in Computer Science, Information Technology or related qualification
  • At least 3 years application development experience using programming tools such as ABAP/4, Visual Basic, ASP, Java, MS Transact SQL and Oracle PL/SQL
  • Application support experience with top-notch ERP (e.g. SAP, Oracle) system will be an added advantage
  • Good functional knowledge of ERP business processes
  • Strong technical background with good analytical and problem solving skills

Job Responsibilities

  • Design, develop, test, deploy and maintain applications for ERP systems
  • Undertake application development and enhancement tasks to fulfill users’ requirements
  • Work closely with functional teams to provide seamless integration to other enterprise and related systems, where applicable
  • Support and troubleshoot issues arising from the systems and/or interfaces to other systems
  • Provide relevant system and user documentation

Die Attach Engineer

Requirements

  • Degree in Electronics / Electrical /Mechanical Engineering.
  • Min 2 years in semiconductor industry in the field of assembly engineering.
  • Experience in die attach process.
  • Good knowledge of FMEA, DOE, SPEC and risk analysis.
  • Independent with good communication skills and ability to work effectively in a cross functional environment with people at all levels.

Job Responsibilities

  • Responsible for process ownership of Die Attach machine in assembly line.
  • Establish and setup new die attach assembly process capabilities and materials including hand-on equipment setup.
  • Monitor performance, quality and reliability of die attach process. Identify problems, recommendation, and implementation of corrective and preventive actions.
  • Support engineering build requests, rump ups and platform extensions.
  • Monitor and improving the yield of die attach process, including cost reduction activities.

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