Failure Analysis

Introduction

ASEM Failure Analysis (FA) and Reliability Lab is a one stop analysis center with the latest cutting-edge FA and Reliability equipment to analyze package related failures and also to stress the package according to the latest industry requirements to ensure the highest quality assembled products are shipped out to our end customers. Our well-equipped Lab supports a variety of FA and Reliability analysis from product package design, qualification until manufacturing stage including customer returns.

Our well-trained technical specialists with years of working experience are committed to work with highest degree of technical collaboration which will satisfy all your requirements. We are proud to be your one-stop lab service provider with the best affordability and fast turnaround of FA and Reliability Stress result. Our Lab support is 24x7 which is one of the best services in town!

Scanning Electron Microscope (SEM) / EDX

This analytical technique used for image magnification and elemental analysis or chemical characterization.

OPERATING RANGE:

  • Energy Dispersive : 0.5KV ~ 30KV
  • Magnification : 40X~ 200KX

Output

3D Scanner

Field Emission Scanning Electron Microscope (FESEM) / EDX

This analytical technique used for high resolution image magnification and elemental analysis or chemical characterization.

OPERATING RANGE:

  • Energy Dispersive : 0.5KV ~ 30KV
  • Magnification : 2X~ 200,000X

Output

Time Domain Reflectrometry (TDR)

To characterize and locate faults in metallic cables with objective for fault isolation failure location.

OPERATING RANGE:

  • 80E04 – Trigger Pre-scale Input
  • 2 - 10GHz (2.5v pk-pk MAX)
  • Rise time (17.3ps +/- 2.1)

Output

Visual Inspection Scopes

High Power Magnification

Optical inspection at high magnification.

OPERATING RANGE:

  • Magnification : 50x - 1000x

Output

Low Power Magnification

Optical inspection at low magnification.

OPERATING RANGE:

  • Magnification : 6.7x - 50x

Output

Curve Tracer

Electrical Bench Test (Curve Tracer)

To perform semiconductor IV analysis to validate failure prior to destructive FA analysis.

OPERATING RANGE:

  • Max Current: 100mA
  • Max Voltage: 20V

Output

Microprober

Fault isolation test between package and die.

OPERATING RANGE:

  • Max Current: 100mA
  • Max Voltage: 20V

X-Ray

To inspect damages/ defect on wires or solder balls.

OPERATING RANGE: Dispersive

  • Seal-Transmissive X-Ray Tube
  • 0.350 micron feature recognition up to 10W of power

Output

 

Chemical Decap (Auto)

To remove mold compound to inspect internal defect.

OPERATING RANGE:

  • Fuming Nitric Acid (10°C- 90°C)
  • Sulphuric Acid (10°C - 250°C)
  • Mix Acid (10°C – 100°C)

Output

 

Unit After Decap

 

Chemical Decap (Manual)

To remove mold compound to inspect internal defect.

OPERATING RANGE:

  • Fuming Nitric Acid & Sulphuric Acid
  • Temperature: 50°C - 300°C

Output

Laser Decap

To thin down mold compound prior to chemical decap.

OPERATING RANGE:

  • Laser Current : 1 TO 100 (Ampere)
  • Speed : 1 to 7620 (units/sec)

Output

Cross Section

Cross section to the desired area for failure analysis.

OPERATING RANGE:

  • 120 Grits (Roughest)
  • 4000 Grits (Smoothest)
  • Micropolish : 5.0u to 0.05u

Output

Fourier Transform Infrared Spectroscopy (FTIR)

To identify organic material.

OPERATING RANGE:

  • Wavenumber : 4000-650 CM-1

Output

Ion Miller

Cross-section polishing prior to SEM analysis

OPERATING RANGE:

  • Accelerating Voltage : 2- 10 KV
  • Milling Rate : 150um/h on Si

Output

Thermal-Emmi Microscopy

To detect thermal or photo emission of a fault location within a package or die level.

DETECTION CAPABILITY:

  • Thermal Hot Spot Detection
  • Photo Emission Spot Detection

Output

FA Lab Equipment List