ASEM Failure Analysis (FA) and Reliability Lab is a one stop analysis center with the latest cutting-edge FA and Reliability equipment to analyze package related failures and also to stress the package according to the latest industry requirements to ensure the highest quality assembled products are shipped out to our end customers. Our well-equipped Lab supports a variety of FA and Reliability analysis from product package design, qualification until manufacturing stage including customer returns.
Our well-trained technical specialists with years of working experience are committed to work with highest degree of technical collaboration which will satisfy all your requirements. We are proud to be your one-stop lab service provider with the best affordability and fast turnaround of FA and Reliability Stress result. Our Lab support is 24x7 which is one of the best services in town!
To remove all moisture from the package so that it will be “dry" for subsequent process
To simulate the thermal and mechanical stress imposed on device when mounted on PCB
To evaluate package and die interface mechanical resistance to alternate exposure of high and low temperature changes, as well as its ability to withstand cyclical stresses
To evaluate the stress test integrity of mold compound and leadframe interface to simulate extreme operating conditions (pressure, temperature and humidity for various lengths of timeframe)
To evaluate the stress test integrity of mold compound and leadframe interface to simulate extreme operating conditions (temperature and humidity for various lengths of timeframe with or without biased)
To evaluate the moisture resistance (preconditioning) of package as per MSL level or customer requirement.
To evaluate the thermal and mechanical stressed imposed on a device during SMT/Reflow process
To perform non- destructive study on the package structure for any abnormality such as delamination, cracking etc using acoustic signal