Leadframe Packaging

ASE Leadframe packages are common in consumer products, automotive devices, memory, analog ICs, and microcontrollers. These packages have evolved into a state-of-the-art technology owing to their robust reliability and great improvement on performance.

ASE Leadframe Packaging Offerings

Based on copper lead frame, Quad Flat No-lead (QFN) or microchip carrier uses half-encapsulation technology to expose the rear side of the die pad and the tiny fingers, which are used to connect the chip and bonding wire with the PCB. QFN packages are suitable for applications over 12GHz working frequency. Providing both thermal and electrical enhancement, QFN is a cost-effective packaging solution due to its economical materials and simpler packaging process.

Application

Telecommunication Product
  • Cellular Phones
  • Wireless LAN
Portable Products
  • Personal Digital Assistants
  • Digital Cameras
Low to Medium Lead Count Packages
  • Information Appliances

Features

  • Small footprint
  • Low profile < 0.45mm (0.152 L/F + 0.27 Mold)
  • Light weight
  • Cost effective
  • Better electrical performance
  • Better power dissipation

Advanced Quad Flat No-lead. aQFN™ is solution for Lead less, multi-row and fine pitch lead frame package with enhanced Thermal/ Electrical performance. aQFN™ is a cost-effective packaging solution due to its economical materials and simpler packaging process.

Application

Telecommunication Product
  • Cellular Phones
  • Wireless LAN
Portable Products
  • Personal Digital Assistants
  • Digital Cameras
Low to Medium Lead Count Packages
  • Information Appliances

Features

  • Low profile, small footprint and light weight
  • Free-form I/O design
  • Fine lead pitch 0.4mm
  • Excellent thermal performance
  • Excellent electrical performance
  • Good SMT performance
  • Cost effective package
  • Extend QFN I/O count up to 400

Quad Flat Package (QFP) is popular among the quad packages. The reason is the fine etching or stamping lead frames enables QFP to contain more leads and feature a smaller profile to perform better electrical characteristics by shortening the interconnection (the lead width can be as small as 0.16mm while the outer lead pitch is 0.4mm only). The thinner and flexible leads in gull-wing shape also provide better 2nd-level reliability (package-to-PCB reliability).

The package with drop-in HS can allow more than 50% power dissipation compared with a conventional package (e.g. in QFP 28x28mm, the allowable power of standard type and the type with HS is about 2.1W and 3.5W respectively). This drop-in HS drives off the heat from the chip more easily by extending the conduction area, and transferring more heat via the lead frame. QFP with drop-in HS is to package sizes of 14x20, 28x28, and 32x32mm.

Application

Products
  • Portable Consumer Products (PDA, Digital Camera, etc)
  • System Board
  • Power Controller

Quad packages have been used for years to meet increasing challenges of faster processors/controllers, ASICs, DSPs, gate arrays, logic, memory ICs (EEPROM, Flash, DRAM & SRAM), PC chipset, video-DAC, multi-media and other related application.

HS-QFP is suitable for use in high thermal applications like power & voltage regulators, power amplifiers, etc.

Features

  • High-speed data processing
  • High density interconnection
  • Cost competitive
  • MCM/stack structure design
  • High thermal conductive
  • Fine pitch wire bond capability
  • Pb-free process ready and available
  • JEDEC standard compliant

Low profile and thin Quad Flat Packages (QFP) are classified by the overall thickness (t) according to JEDEC definition:

  • L type: 1.2< t <=1.7 mm
  • T type: 1< t <=1.2 mm

Low profile and thin QFPs are becoming popular, as they are ideal for the applications in lightweight and portable electronic products. ASE offers the lead count of LQFP/TQFP ranging from 32 to 256 and 44 to 176 respectively, covering almost all the applications in memory, DSP, and communication ICs. Due to the low electrical parasitic out of the small outline and shorter leads, low and thin QFPs are suitable for RFICs, and a cost-effective alternative to expensive ceramic QFPs.

Exposed Pad L(T)QFP

The exposed pad can be soldered to the PCB so that the heat can be driven off directly (the JA is only half as much as the standard L(T)QFP). Besides, this pad is also electrically grounded, and thus results in far smaller ground inductance. Exposed pad L(T)QFP is a cost-effective solution suitable for enhancing thermal and electrical performance.

Application

Telecommunication Product
  • Cellular Phones
  • Wireless LAN
Portable Products
  • Personal Computer
  • Personal Digital Assistants
  • Digital Cameras
Low to Medium Lead Count Packages
  • Information Appliances

Features

LQFP/EP-LQFP Packing Offering
  • 7x7mm to 28x28mm body size available
  • Wide selection of pad size to meet die requirements
  • Customize leadframe design capability
  • 32 ~ 256 leads counts available
  • Fine pitch wire bond capability
  • Lead free process ready and available
  • High conductivity copper leadframes
  • Low stress die attach materials
  • Power enhancement version
  • JEDEC standard compliant
TQFP/EP-TQFP Packing Offering
  • 7x7mm to 14x14mm body size available
  • Wide selection of pad size to meet die requirements
  • Customize leadframe design capability
  • 32 ~ 128 leads counts available
  • Fine pitch wire bond capability
  • Lead free process ready and available
  • High conductivity copper leadframes
  • Low stress die attach materials
  • Power enhancement version
  • JEDEC standard compliant