As the demand of high power density and highly reliable electronic packages grows, thermal management becomes a crucial issue. Hence, electronic package designers have to consider the optimization of thermal performance in early development stage. ASEM offers state-of-art thermal modeling using commercial FEM software ANSYS that enables engineers to predict the thermal performance with the material structures and package geometry. ASEM provides component- level and system-level thermal analyses with elements such as heat slug, heat sink and PCB. The optimized thermal solution and design can be provided through the fast and reliable FEM analyses. Customer can utilize the information to optimize the design by making modification prior to fabrication which can reduce cycle time to market and cost.

Thermal Parameters