|
Product & Package Range
| Wafer Soft |
Final Test
| Test
Setup Roadmap | Test
Backend Services | Paperless
Manufacturing | Drop
Ship Service
Wafer Soft
 |
Inkless Probing / Wafer Mapping |
| Packages |
Tests |
| Wafer
Size- |
6
- 8 (inch.) |
| Wafer
Thickness - |
15
mil (min.) |
| Probe
Temp. - |
Ambient
- 135°C |
| Clean
Room - |
Class
5K |
Existing prober available
- TSK UF200
- EG4090 U
- Flexible in qualitying new prober model |
|