Product & Package Range | Wafer Soft | Final Test | Test Setup Roadmap | Test Backend Services | Manufacturing System | Drop Ship Service

Probing with Inkless Wafer Mapping Wafer Size- 5” - 12” (inch.) Wafer Thickness - 13 mil (min.) In Line Pad Pitch - 45 micron(min) Staggered Pad Pitch - 40 micron(min) Probe Temp.- Ambient - 135°C - Multi-sites probe capability. - Sample sort process. - Inking is available as 'non-std' option. - Full support on probe card fabrication and maintenance. Probecard Analyser: - Alignment, Coplanarity, Contract Force. - Contract resistance, Leakage, Wire Check. - Centilever/Vertical Probecard. Sorter: - Uses patented technology providing vacuum-free edge or back side contact wafer transfer. - FFU ensures a Class 0.1 mini-environment. - Efficient alignment & OCR device embedded on the end effector, for high throughputs. Inspection: - Class 5K Operation. - Integrated Image Capturing. - High throughput.