|
Product & Package Range
| Wafer Soft |
Final Test
| Test
Setup Roadmap | Test
Backend Services |
Manufacturing System | Drop
Ship Service
Wafer Soft
|
Probing with Inkless Wafer Mapping |
| Wafer Size- |
5
- 12 (inch.) |
| Wafer
Thickness - |
13
mil (min.) |
| In Line Pad Pitch - |
45 micron(min)
|
| Staggered Pad Pitch - |
40 micron(min)
|
| Probe Temp.- |
Ambient
- 135°C |
- Multi-sites probe capability.
- Sample sort process.
- Inking is available as 'non-std' option.
- Full support on probe card fabrication and maintenance.
Probecard Analyser:
- Alignment, Coplanarity, Contract Force.
- Contract resistance, Leakage, Wire Check.
- Centilever/Vertical Probecard.
Sorter:
- Uses patented technology providing vacuum-free edge or back side contact wafer transfer.
- FFU ensures a Class 0.1 mini-environment.
- Efficient alignment & OCR device embedded on the end effector, for high throughputs.
Inspection:
- Class 5K Operation.
- Integrated Image Capturing.
- High throughput.
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