Product & Package Range | Wafer Soft | Final Test | Test Setup Roadmap | Test Backend Services | Paperless Manufacturing | Drop Ship Service
Latest laser and camera technology/system for scanning various J-Leads, gull wing and BGA products
Capability in tapping various J-Leads, gull wing and BGA products
All equipment with built-in vision for quality assurance
Existing product moisture sensitive level I, II, III and IV
Automated system in handling and barcoding
Flexibility in packing per customers' requirement or ASE Malaysia standard