Periodic Monitoring Packages Under Periodic Monitoring | Reliability Stress Test | Failure Criteria - Report Reliability ENVIRONMENTAL TEST Temperature Cycle     - MIL STD 883 M1010 - 55°C/ 125°C X1000 (Cond B) - 65°C/ 150°C X1000 (Cond C) - Optional - Powered TC       Pressure Cooker Test (PCT)     - 121°C/ 100%RH / 15 psi/ 168hrs - Optional - Voltage biasing         Highly Accelerated Stress Test (HAST)     - 130°C/ 85%RH / 15 psi/ 168hrs - Optional - Biasing         Temperature & Humidity Storage     - MIL STD 883C / JEDEC A112/113 - Ta = 30°C - 85°C / Rh = 0% - 90% - Optional - Biasing   RELIABILITY CAPABILITY SOLDERABILITY Wet Balancing - J STD 002 / IPC - Lead Conditioning    - Bake 175°C / 2 hrs.    - Steam Aging (93°C/ 8 hrs) - FLUX ALPHA 100 - SOLDER POT Ta = 219°C/ 245°C     REFLOW SIMULATION IR Reflow - JEDEC A112/113 - CONVECTION / IR TYPE - Maximum peak Ta = 350°C - Typically 3X REFLOW.