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RELIABILITY MONITORING PROGRAM
- Reliability monitoring program per quarterly by each package family.
- Package family covered are SOIC, TSSOP, LQFP, TQFP, QFP, PLCC, LBGA,
PBGA, HSBGA, CSBGA, QFN.
- Full rel test flow (MSL, TC, UHAST, PCT, HTS).
- Sample size: 120units (each stress test 30 units)
TIN WHISKERS MONITORING PROGRAM
- Tin whiskers monitoring per quarterly by plating material & plating track
line.
- Follow JEDEC standard JESD 201.
- Follow manufacturing process change parameter.
- Class level for testing - class 2 (Business critical applications such as
Telecom Infrastructure equipment, High-End Servers, Automotive).
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