Periodic Monitoring Packages Under Periodic Monitoring | Reliability Stress Test | Failure Criteria - Report Reliability PACKAGE UNDER RELIABILITY MONITORING PROGRAM Packages Tests Conditions SOIC PLCC PDIP PQFP TQFP LQFP PBGA Temperature Cycle Cond C (-65°/150°C) Cond B (-55°/125°C) Pressure Cooker 121°C/100%RH/15PSI 168 HRS Scanning Acoustic Microscope 15-50 MHz