Periodic Monitoring
Packages Under Periodic Monitoring | Reliability Stress Test | Failure Criteria - Report Reliability



SCANNING ACOUSTIC MICROSCOPE


 SAM


- JEDEC A112/113
- ZERO DELAM on die surface
- DELAM ON Die Attach Pad
  - 10% (PRE STRESS)
  - 25% (POST STRESS)
   
 Reject Confirmation


- Cross-section analysis
- SEM / Visual inspections



Automatic Test Equipment TESTING & VISUAL INSPECTION


For package tested in ASE Malaysia only

- Go/No go Electrical Testing.

External Visual Inspection
- 30X to box magnification for external package damage.
- Higher magnification (100x to 1000x) for confirmation of rejects.