Analytical Capability
Eletrical | Decapping | Package Cross Sectioning | SEM Micrographic Analysis | Material Analysis | Non Destructive Analysis


 PACKAGE CROSS SECTIONING

 

Sawing / Grinding / Polishing
- Buehler Equipment
- Polishing down to 0.05 um
- Au Ball Cross Section for Bond Pad Metal Collapse
- Au-Al Inter Metalisation