Analytical Capability
Eletrical | Decapping | Package Cross Sectioning | SEM Micrographic Analysis | Material Analysis | Non Destructive Analysis


 NON DESTRUCTIVE ANALYSIS

 

SAM ANALYSIS
- SONIX HS1000
- A-SCAN / B- SCAN / C-SCAN
- Through scan capability
- TAMI Capability (30 Layers)
- 3D Images
- Iceberg Image Analysis Software

X-RAY ANALYSIS
- Nicolet Real-time X-ray
- Max 120KV
- Phoenix fine focus X-ray (<10pm) 130KV