LBGA PBGA | HSBGA| CSBGA | EPBGA | LBGA


Product Overview:
CSP(chip scale package or chip size package) is a package that has an area of not more than 120% of the die. It is suitable for compact 2nd-level packaging efficiency. CSP BGAs are the best solution to both dense layout and small outline requirements. Four layer BT substrates are available for these packages to provide electrical characteristics.

Low and Thin BGAs are suitable for high-performance ICs like flash, SRAM, DSP memory, communication ICs and RFICs. Common applications of Low and Thin BGAs are computer and communication products, such as PDA, notebooks and memory cards, cell phones, mobile stations and wireless systems.

Product Definition:
Package Type
Description
Overall Thickness
Ball Pitch
LBGA
 Low profile Ball Grid Array package 1.2 < Ts1.7 1.0/1.27/1.5
LFBGA
 Low profile Fine pitch Ball Grid Array package 1.2 < Ts1.7 0.5/0.65/0.8
TBGA
 Thin profile Ball Grid Array package 1.0 < Ts1.2 1.0
TFBGA
 Thin profile Fine pitch Ball Grid Array package 1.0 < Ts1.2 0.5/0.65/0.8
VFBGA
 Very thin profile Fine pitch Ball Grid Array package 0.8 < Ts1.0 0.5/0.65/0.8
WFBGA
 Very Very thin profile Fine pitch Ball Grid Array package 0.65 < Ts0.8 0.5/0.65
UFBGA
 Ultra thin profile Fine pitch Ball Grid Array package Ts0.6 0.5
Package Offering
Body Size (mm)
Ball Count
 
Ball Pitch (mm)
Ball Size (mil)
64
 4X4 0.40 10
132
 6X6 0.40 10
56
 6X6 0.50 12
132
 8X8 0.50 12
361
 13X13 0.65 12
100
 9X9 0.80 18
142
 10X10 0.80 18
148
 12X12 0.80 20
160
 12X12 0.80 20
256
 14X14 0.80 18
280
 16X16 0.80 16
400
 18X18 0.80 16
484
 19X19 0.80 20
484
 19X19 0.80 16
484
 19X19 0.80 18
525
 19X19 0.80 18
64
 9X9 1.00 18
81
 10X10 1.00 18
100
 11X11 1.00 25
132
 13X13 1.00 20
144
 13X13 1.00 25
196
 15X15 1.00 20
225
 16X16 1.00 20
256
 17X17 1.00 25
260
 19X19 1.00 18
324
 19X19 1.00 25
361
 21X21 1.00 25
400
 21X21 1.00 25
241
 23X23 1.27 30