LBGA PBGA | HSBGA| CSBGA | EPBGA | LBGA


Product Overview:

CSP(chip scale package or chip size package) is a package that has an area of not more than 120% of the die. It is suitable for compact 2nd-level packaging efficiency. CSP BGAs are the best solution to both dense layout and small outline requirements. Four layer BT substrates are available for these packages to provide electrical characteristics.

Low and Thin BGAs are suitable for high-performance ICs like flash, SRAM, DSP memory, communication ICs and RFICs. Common applications of Low and Thin BGAs are computer and communication products, such as PDA, notebooks and memory cards, cell phones, mobile stations and wireless systems.

Product Definition:
Package Type
Description
Overall Thickness
Ball Pitch
LBGA
Low profile Ball Grid Array package 1.2 < Ts1.7 1.0/1.27/1.5
LFBGA
Low profile Fine pitch Ball Grid Array package 1.2 < Ts1.7 0.5/0.65/0.8
TBGA
Thin profile Ball Grid Array package 1.0 < Ts1.2 1.0
TFBGA
Thin profile Fine pitch Ball Grid Array package 1.0 < Ts1.2 0.5/0.65/0.8
VFBGA
Very thin profile Fine pitch Ball Grid Array package 0.8 < Ts1.0 0.5/0.65/0.8
WFBGA
Very Very thin profile Fine pitch Ball Grid Array package 0.65 < Ts0.8 0.5/0.65
UFBGA
Ultra thin profile Fine pitch Ball Grid Array package Ts0.6 0.5
Package Offering
Body Size (mm)
Ball Count
 
Ball Pitch (mm)
Ball Size (mil)
64
4X4 0.40 10
132
6X6 0.40 10
56
6X6 0.50 12
132
8X8 0.50 12
361
13X13 0.65 12
100
9X9 0.80 18
142
10X10 0.80 18
148
12X12 0.80 20
160
12X12 0.80 20
256
14X14 0.80 18
280
16X16 0.80 16
400
18X18 0.80 16
484
19X19 0.80 20
484
19X19 0.80 16
484
19X19 0.80 18
525
19X19 0.80 18
64
9X9 1.00 18
81
10X10 1.00 18
100
11X11 1.00 25
132
13X13 1.00 20
144
13X13 1.00 25
196
15X15 1.00 20
225
16X16 1.00 20
256
17X17 1.00 25
260
19X19 1.00 18
324
19X19 1.00 25
361
21X21 1.00 25
400
21X21 1.00 25
241
23X23 1.27 30