Product Overview:
Heat slug BGA (HSBGA) is an upgraded type of PBGA. Within the molding area, a piece of copper heat slug is implanted.
The heat slug is intended to lower the thermal resistance(BJA) of PBGA without change of material. The BJA of HSBGA is
generally 20% lower than PBGA and achieves 5 to 6W of thermal dissipation under natural convection. This technology
can be applied to any kind of die-up substrates (e.g. 2- or 4-layer BT,and metal core). HSBGA is an excellent solution for cost-effective high power package, high speed ICs like graphics chips, communication and networking ICs.
Package Offering
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