Product Overview:
Cavity-down Thermally Enhanced BGA is the solution for thermal dissipation requirements of over 6W. It is designed with the
chip seated onto the copper heat sink to absorb the heat easily. This method desensitizes the performance deviation out of
the chip size and lowers the thermal resistance of junction-to-case (BJC), which makes the external heat sink or fan work more effectively.
ASE's Cavity-Down BGAs are offered through CSBGA. Both open tool and close tool are available. In general, Cavity-Down
BGA enhance thermal performance by about 15 - 20% improvement compare with 4-layer PBGA and by 35% compare with
2-layer PBGA. Electrical performance of Cavity-Down BGA is significant as well. The reason is attributed to their flexible
layout for staggered traces on different layes, shorter VIAS and better shielding effect out of the cooper heat sink. With
the heat sink covering the signal traces fully, Cavity-Down BGA provide better resistance to external EMI (Electro-Magnetic
Interference) noise.
Cavity-Down BGA is an excellent solution for graphic, networking, and communication ICs with high-power and high-speed
quality performances.
Package Offering
|
