Electronic package structure is built with various materials such as chip silicon, copper leadframe, substrate, epoxy, heat slug and mold compound. Every individual material behaves differently in different environment and temperature during the reliability testing and field application. This phenomenon induces stress-related issues during processes or application environment such as warpage, die crack, delamination, and solder joint fatigue. Mechanical simulation using FEM commercial software ANSYS can help to predict the potential risk of package and chip failures. The analyses can be used to minimize the package thermal stress and warpage by optimizing the material selection and package geometry.

Capabilities:
- Package or strip warpage
- Material interface delamination
- Die stress and crack
- Leads vibration due to bonding forces
- Solder joint life prediction ( In progress)