TRAINING

As a commitment to continuously grow and upgrade our employees a training center has been set-up to provide the necessary training and development to our employees. The center is equipped with:

- Training Rooms
- Technical Lab
- Computer Lab
- Skills Training Lab
- Library.

In addition, employees are given the opportunity to further enhance their academic development through the Education Assistance Program and Overseas Training to acquire knowledge and skills for the development of new products and enhancement of technology, processes and equipment.



SIX SIGMA IN ASE

Our focus in ASE is to :
- Delight customers through Flawless Execution
- Achieve rapid breakthrough improvement
- Develop advanced breakthrough tools that work
- Instill positive & deep culture change
Incorporating Six Sigma will bring us towards achieving these goals

ABOUT SIX SIGMA

  1. Six Sigma's View on Quality

    -

    performing 100% inspection is inefficient

    -

    management is key to success

    -

    the focus should be on the process parameter

    -

    continuous improvement is a philosophy of doing business

    -

    reduction of variation of input is imperative


  2. Concept of variation

    -

    there is a variation in everything although in some cases, it is so small that it is difficult to be detected.

    -

    in the Six Sigma perspective, variation in a product is due to variation in the process itself

    -

    therefore quality efforts should shift from inspection of end products to the process of creating a product


  3. Focus of Six Sigma

    -

    reduces cycle time per unit

    -

    reduces WIP inventory carrying costs

    -

    reduces delivered defects

    -

    reduces early life failures

    -

    reduces "hidden factory" costs


  4. Phases of Six Sigma

    -

    Identification of a problem (Measurement)

    -

    Identify the cause of the problem (Analysis)

    -

    Eliminate (diminish effect) of the cause (Improve)

    -

    Maintaining the solution (Control)


Six Sigma Deployment in ASE - How did we start off

First, training on the Overview of Six Sigma was provided to management staff. From there we moved on to train key managers (those with Six Sigma projects in their areas) on Championship Training. Very key in this training is how to be good champions that can motivate & guide Black Belts to be successful in their projects. Once this was completed, the Black Belts were then trained on how to use the Six Sigma methodology & tools on their projects. (Black Belts are team leaders of Six Sigma projects).

Following are the projects that the current Black Belts are working on & the status:-

CURRENT PROJECT UPDATES

 Project Title

Status

1.

Reduce RVSI scanning from 100% to sampling

Control Phase

2.

Reduce NSOP defect

Control Phase

3.

Solder mask crack reduction

Control Phase

4.

PBGA RVSI improvement

Analyze Phase

5.

Epoxy wastage reduction

Control Phase
6. Bent / damaged leads & package chip improvement for Agilent PDIP 16L Control Phase
7. Incomplete bond on PBGA packages Control Phase
8. Develop Copper Leadframe QFN Sawing Using Thick Blade(0.5mm & above) Measure Phase
COMPLETED PROJECTS
 Technical Reports
1. Reducing extra ball consumption and rework rate
2. Reduce Plating overall packages % LRR by reducing EPM & rough surface defect
3. Clamp Mark Elimination
4. Omis Coplanarity Qualification for Flip Chip Bump Measurement
5. PQFP 132 Wire Defects Reduction
6. Package Coplanarity Improvement For EPBGA 45 X 45
7. Reduce Inspection (SVI & FVI) For SOIC
8. Reduce High Rejects at TR&R Process For SOPW 16
9. Epoxy Bleed Out Characterization Study On Molded Frame
10. Increase tool Life
11. Reduce sample lead scan for PLC 20LD
 Project Summary
1. Clamp Mark Elimination
2. OMIS Copanarity Qualification from Flip Chip Bump Measurement
3. PQFP 132 Wire Defects Reduction
4. Reduce Inspection (SVI & FVI) For SOIC
5. Epoxy Bleed Out Characterization Study On Molded Frame
6. Package Coplanarity Improvement For EPBGA 45 X 45



ASE Paper Presentation

Paper Presentations are organized in ASE with the objective of creating a Learning Environment through Sharing of Knowledge.
In the Paper Presentation, individuals or teams share improvements, breakthroughs or new findings with the rest of the employees.
These presentations have helped cultivate a Continuous Learning Culture among employees.
At the same time we are also able to tap the talents & potentials of employees and upgrade our skills by keeping pace with the technological advancement.

The following 2 papers were published in the Unpresented Papers section in the 2002 SEMICON Exposition in Singapore.

1. Lead Free Plating - An In-House Solution
2. Substrate Interposer Package

Technical papers presented in ASEM Paper Presentation:

 1. Analysis on Bond Pad Voids
 2. Clean Dry Air - Zero Air Loss Technology
 3. Failure Analysis on BGA Packages Using TDR
 4. Lead Free Plating - An In-House Solution
 5. Revealing Hidden Internal Defects in Flip Chip via High Frequency
    Scanning Acoustic Microscope (SAM)

 6. Study of Moisture Sorption into Plastic Surface Mount
 7. Substrate Interposer Package
 8. ASE Pbfree Whisker Overview
 9. Epoxy on Die or Lead
10. Scan Auto Summary Checklist System
11. Tin Strike - Technique to Eliminate formation of Whisker during machine
    stoppage in the Plating Process

12. Thermal Transient Analysis Via Feat
13. Side Flash Bridging Elimination
14. Moving Toward An Environment Friendly Process