Design & Development Engineer

• • Degree in Electrical/Electronic/Mechanical Engineering or Applied Science (Physics)
• • 3 years’ experience in the semiconductor Front-of-Line die-attach/wire bond process.

• • Responsible for new material evaluation • Develop new technology and packages
• • Carry out customer technical support.

Test Equipment Engineer (Tester/Handler)

• • Degree in Electrical/Electronic/Mechanical Engineering
• • Experience in the semiconductor environment, preferably in testing operation
• • 3 years’ experience in the semiconductor environment, preferably in high volume manufacturing, Experience in handling PnP/Gravity/Turret based handlers & ATE testers.

• • Responsible for system integrator i.e. handler/tester/hardware
• • Improve on process/machine capability procedures.

QA Engineer

• • Degree in relevant fields of Engineering or applied Science with 3 years’ experience in the semiconductor environment preferably in QA operation
• • Knowledge in SPC, FMEA, OCAP, DOE, process change and problem solving tools
• • ISO and TS16949 quality system knowledge

• • Initiate and drive quality improvement activities • Liaise with customers on quality issues/requirements and escalation for improvement plans
• • Lead quality team in respective sections and identify areas for improvement
• • Conduct and manage internal and external audit activities and ensure compliance

New Product Introduction (NPI) Engineer

• • Degree in Electrical/Electronic/Mechanical Engineering or Applied Science (Physics)
• • 3 years’ experience in the Front-of-Line semiconductor processes with new product introduction & development for semiconductor packages
• • Knowledge in APQP system & program implementation will be an added advantage.

• • Coordinate & follow up on the new product qualification/evaluation run activities
• • Work with relevant departments & customers on engineering issues pertaining to engineering/qualification builds
• • Drive quality, yield & OTD improvement for engineering/qualification builds
• • Lead & drive multi-disciplinary team on new product/process introduction program with APQP approach • Drive NPI system enhancement projects.

Design & Development Engineer

• • Degree in Electrical/Electronic/Mechanical Engineering or Applied Science (Physics)
• • 3 years’ experience in the semiconductor Front-of-Line die-attach/wire bond process

• • Responsible for new material evaluation • Develop new technology and packages
• • Carry out customer technical support.

Facilities Engineer

• • Degree in Electrical/Mechanical Engineering with minimum 3 years’ experience in a related field
• • Good knowledge of DI water system, waste water system, chilled water system and electrical works.

• • Assist in carrying out planning, safe operation and maintenance of the plant wide facilities system i.e. building automation system, air-conditioning, compresses air, fire protection & DI water systems and sewage treatment plant
• • Work with consultants and contractors on the implementation of plant expansion projects and upgrade of facilities system and equipment
• • Ensure that the plant air-conditioning supply environment and utilities supplies meet production and QA specifications.

Wirebond Engineer

• • Degree in Electrical/Electronic/Mechanical Engineering
• • 3 years’ experience in the semiconductor Front-of-Line operation
• • Good knowledge & experience in problem-solving with good leadership qualities.

• • Lead a group of Engineers in dealing with daily quality & customers’ issues
• • In charge of wire bond engineering for all non-leaded packages including encapsulation & plasma processes
• • Responsible for new taping and encapsulation. In charge of WB yield driver i.e. driving yield improvement with proven methodology & approach as well as driving wire bond yield & quality issues.

FOL Equipment/Preventive Engineer

• • Degree in Science (Physics) or Electrical/Electronic/Mechanical Engineering
• • 3 years’ experience in the semiconductor Front-of-Line operation.

• • Carry out machine upgrading with full-proof system •Perform equipment preventive/predictive maintenance
• •Generate and maintain preventive maintenance specifications
• • Provide training on machine operation
• • Responsible for project identification and implementation in the areas of productivity, yield & cost-saving improvement

Ball Mount Engineer

• • Degree in Electrical/Electronic/Mechanical Engineering • 3 years’ experience in the semiconductor End-of-Line operation.

• • Provide process equipment engineering support to EOL operations to meet set performance objectives
• • Execute the installation of new processes/products & packages
• • Provide engineering support for continuous improvement of existing & new processes
• • Responsible for project identification & implementation in the areas of productivity & yield improvement.

Mold Engineer

• Degree in Electrical/Electronic/Mechanical Engineering
• • 3 years’ experience in the semiconductor End-of-Line operation.

• • Perform routine product sustaining functions, failure analysis & resolve any engineering issues
• • Conduct engineering evaluation & characterization via usage of DOE/FMEA methods.
• • Evaluate, characterize & execute process engineering in area of responsibility to drive improvement in areas of quality, yield & cost

DTFS Engineer

• • Degree in Electrical/Electronic/Mechanical/Automation/Tooling Engineering, Physics, Material Science or Mathematics
• • 3 years’ experience in the semiconductor End-of-Line operation.

• • Perform in-line process monitoring activities, engineering evaluation, experiment & process characterization & optimization plans
• • Provide a strong analytical & problem-solving aptitude through technical discipline report & provide effective corrective or preventive actions to prevent recurrence on customers’ returns
• • Responsible for Bill of Material (BOM), Engineering Request Change (ERC) & Material Review Board (MRB) & recommend implementation.