| Position |
Requirement |
Job Responsibilities |
ENGINEERS
( ASSEMBLY )
SAWING / DIE PREP / WIREBOND / FOL EQUIPMENT & MAINTENANCE ENGINEERS. MOLD / DTFS & PLATING AND QA
|
-
Bachelor's Degree in relevant fields in Electrical / Electronics / Mechanical / Physics / Material Science / Mathematics .
- Experience in a semiconductor environment is an added advantage.
|
-
New Project start-up. To execute the installation of new processes / product and packages.
- New product transfer. To perform electrical yield and quality optimization.
- Provide engineering support for continuous improvement of existing and new processes.
- To lead a group of technicians in maintaining equipment.
- To perform equipment preventive/predictive maintenance
- Work with supplier for new machine capability
- To perform internal quality management system audit per ISO9001/TS16949's requirements, ESD implementation program.
- Knowledge in Cost of Quality, Customer Complaint & Document Control
- Project identification and implementation. Expected projects are :
i. Productivity improvement.
ii. Yield improvement.
iii. Cost saving.
|
| TEST PRODUCT ENGINEER
|
- Bachelor's Degree in relevant fields in Electronics or Electrical Engineering or Physics or equivalent with minimum 1 years of experience.
- Knowledge of programming languages, C or Visual Basic
- Familiar with DOS, Windows NT/XP or Unix.
- Knowledge of HP8300/ 93000/ 94000 & Catalyst tester would be an advantage.
- Other Attributes : Excellent interpersonal skill at all levels, strong leadership, organizational skill, analytical skills and result oriented.
|
- Responsible for a group of products assigned, in terms of yield, engineering issues, test correlation, test strategies and customer communications.
- Responsible for test yield improvement at wafer sort testing & final test.
- Provides customer support on Test Engineering activities.
- Handles the project set-up at Test Engineering area.
- Test software/hardware improvement/optimization
- Provides production support at Test Engineering area
- Coordinate failure analysis on customer returns and productions rejects.
|
| DESIGN & DEVELOPMENT ENGINEER
|
- Bachelor's Degree in relevant fields of Engineering or applied Science ( Physics ) Engineering ( Electrical & Electronics / Mechanical).
- Experience in semiconductor FOL Die attach / Wire bond process.
|
- New material evaluation.
- Develop new technology and packages.
- Customer technical support.
|
| DESIGN ENGINEER |
- Bachelor's Degree in relevant fields of Engineering or applied Science ( Physics ) /Engineering ( Electrical & Electronics / Mechanical).
- Experience in Semiconductor processes will be an added advantage.
|
- To design substrate / leadframe for the use in IC packages.
- Electrical Modeling.
- Customer technical support.
|
| TEST LINE ENGINEER |
- Bachelor's Degree in relevant fields of Engineering ( Electrical & Electronics / Mechanical).
- Experience in semiconductor industry preferably in TEST operation.
- Engineering with a minimum of three years of experience in high volume manufacturing.
|
- Supervising group of technicians to support equipment setup and repair in excellence manner to meeting production requirement.
- Gather daily equipment capability status, issues and strategize resources coverage to meeting delivery goals.
- Update equipment performance status and strategy in operation meeting to ease stakeholder planing.
- Leading the team in optimize all test plant aspects indicator which include equipment up time, yield, quality, safety and responsible for overall floor equipment readiness.
- Providing hands-on or coaching to maintain fleets of Automated Test Equipment that includes testers associated Automated handler.
|
| TEST PROCESS ENGINEER |
- Bachelor's Degree in relevant fields of Engineering or applied Science ( Physics ) Engineering Electrical & Electronics / Mechanical).
- Experience in semiconductor industry preferably in Testing operation.
|
- Define in house backend process and procedure.
- Work method and process control improvement to reduce quality issue, improve cycle time and maximum manpower.
- Yield control and improvement.
- New process device offload and buyoff
|
| TECHNICIANS
(ASSEMBLY / TEST AND FACILITIES )
|
- Diploma / Certificate in Engineering ( Electric & Electronics). Engineering ( Mechanical ) and Mechatronics.
- Experience in a semiconductor environment is an added advantage.
|
- To perform equipment set-up and maintenance, improvement on equipment utilization and upgrade machine performance.
- Assist engineer to work on cost down projects and yield/quality improvement activities / data collection and evaluation study.
- Coordinate engineering activities, for example defect traceability, root cause investigation and analysis, engineering / Qual lot and etc.
- To provide support to production equipment and personnel.
- Investigates causes of machine breakdowns and implement improvements to prevent further occurrences.
- Carry out preventive maintenance program.
- Preventive Maintenance For Facilities Equipment (HVAC).
- Support 12-hours shifts.
|
| MANUFACTURING EXECUTIVES
( ASSEMBLY / TEST AND MAINTENANCE )
|
- Bachelor's Degree in in any Discipline.
- Experience in a semiconductor environment is an added advantage.
- Minimum 1 year supervisory experience.
- Possess good leadership / communications skills and Interpersonal skills.
|
- Lead the overall production team towards achieving departmental objectives .
- Responsible for In Process Production control (IPPC), planning, coordinating and organizing the head count per machine/process to maximize quality output.
- To achieve 100% SOD.
- Capable to posses assigned improvement project in line with company expansion & customer demand.
- Manage 12 hours shift in delivering output, quality and productivity.
- Good understanding of capacity , wip and mix management.
|
| Industrial Engineer
|
- Degree in Industrial Engineering, preferably with experience in Semiconductor industry
|
- Equipment and labour planning.
- Productivity and cycle time improvement.
- Layout planning.
|